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Key Features

20x Turret Pickup System

Revolutionary 20x turret pick up design with quick-change capability for maximum versatility and efficiency.

High-Speed Performance

Sprint UPH: 24K ~ 30K (QFN 4X4 & 5X5), up to 30K (QFN 2X2) with industry-leading speed and precision.

Versatile Input/Output

Input: Plastic tube / Magazine / Bowl feeder. Output: Plastic tube / Magazine / Tape & Reel with conversion versatility.

Wide Package Compatibility

Min. package size: ≥2x2mm with complete solution for most semiconductor packages including QFN, DFN, SOP, and QFP.

Quick-Change Capability

QFN 4x4 to 6x6 conversion in just 20 minutes with built-in detaping capability for maximum production uptime.

Technical Specifications

Mechanical Features

  • 20x Turret pick up heads (quick-change design)
  • 24x Turret pick up heads (upon request)
  • Min. package size: ≥2x2mm
  • Complete solution for most packages

Input/Output Handling

  • Input: Plastic tube / Magazine / Bowl feeder
  • Output: Plastic tube / Magazine / Tape & Reel
  • Conversion versatility
  • Quick-change capability

Performance

  • Sprint UPH: 24K ~ 30K (QFN 4X4 & 5X5)
  • Sprint UPH: 30K (QFN 2X2)
  • Quick-change: QFN 4x4 to 6x6 in 20 minutes
  • Built-in Detaping capability

Applications

  • Semiconductor packaging (QFN, DFN, SOP, QFP)
  • LED manufacturing
  • Consumer electronics
  • Small form factor components

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