Tray Based Products
Precision-engineered semiconductor test handling solutions for the most demanding industrial applications
Tray Based Solution
Value
Compact
Performance
Advanced
Flagship
Premium
Advanced Technical Specifications
High Throughput
Up to 18,000 UPH (tray-to-tape) and 27,000 UPH (tray-to-tray) for QFN 4×4mm packages
Advanced Vision Inspection
2D in-tray & in-pocket inspection with optional 3D laser and 3 programmable reject trays
Precision Pick & Place
Triple pen with rotator & Dual Universal Gang Pick; supports both heat and pressure sealing
Key Features of Our Tray Based Systems
Modular Design
Easily adaptable to various production requirements
High Throughput
Optimized for maximum production efficiency
Advanced Vision
High-resolution cameras for precision alignment
Safety Features
Protect both operators and equipment