Isometric View
Key Features
High Speed Performance
Sprint UPH: Up to 28K Tray to Tape & Reel, 40K Tray to Tray
Device Size: For devices smaller than 12x12mm
JEDEC Tray Flexibility
JEDEC Tray Input to JEDEC Tray / Tape & Reel Output. De-taping capability included.
Wide Package Compatibility
Supports QFN, BGA, LGA, FCBGA, TFBGA, QFP, TSOP, PLCC, etc. (3x3mm to 60x60mm).
Advanced Pick & Place
Dual UGP (kit-less), Dual Row Gang Pick, and 5X Pick & Place pen with rotator.
Comprehensive Vision Inspection
Bottom 3D Laser / 2D Ball/Lead, 4-Side, In-Tray, In-Pocket, and Post-Seal inspections.
Smart Automation & Rejection
Auto reject/replenish, programmable 3-output tray sorting, and sealing/taping track conversion.