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Universal Gang Pick (UGP)
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Universal Gang Pick (UGP)

Advanced vacuum-based object transfer mechanism for semiconductor inspection

Key Features

Matrix Flexibility

Handles any row or column arrangement regardless of spacing or device count

Single Operation Transfer

Transfers entire rows or columns at one go using vacuum technology

Zero Configuration Change

Adapts to different pocket matrices without mechanical adjustments

Integrated Inspection

Seamlessly transfers devices to vision inspection systems

Cost-Effective Operation

Eliminates tooling change costs and reduces setup time

Revolutionary Semiconductor Handling Technology

The Universal Gang Pick (UGP) is an innovative object transfer mechanism developed by VisDynamics Research Sdn Bhd. It revolutionizes how semiconductor devices are handled during inspection processes.

UGP Mechanism Diagram

How UGP Works

The UGP uses negative pressure (vacuum) to transfer entire rows or columns of semiconductor devices from trays to the inspection system. This innovative approach eliminates the need for individual device handling, dramatically increasing throughput.

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Example: UGP can transfer an entire row (like the first row shown above) regardless of the number of devices or spacing between them.

UGP Workflow in Inspection Process

1

Vacuum Pickup

UGP vacuums up an entire row or column of semiconductor devices from the tray using negative pressure.

2

Transfer to Inspection

The entire row of devices is transferred to the vision inspection system for quality assessment.

3

Quality Assessment

Vision inspection system examines each device in the transferred row simultaneously.

4

Return to Tray

After inspection, UGP returns the devices to their original positions in the tray.

5

Rejection Handling

A separate mechanism removes defective devices based on inspection results.

6

Repeat Process

UGP repeats the process with the next row until all devices are inspected.

Technical Advantages

Adaptive Matrix Handling

  • Accommodates varying pocket matrix designs
  • Handles any spacing between devices
  • Works with different device counts per row/column

Operational Efficiency

  • Eliminates tooling change requirements
  • Reduces setup time between product runs
  • Increases throughput with batch handling

Cost Effectiveness

  • Reduces equipment downtime
  • Minimizes labor for changeovers
  • Eliminates custom tooling expenses

Integrated in T6 EVO System

The UGP is currently incorporated in VisDynamics' T6 EVO tray-based semiconductor devices tape-and-reel and inspection machine. This integration provides a complete solution for semiconductor device handling and inspection.

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